发明名称 |
COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor device capable of obtaining excellent and stable withstand voltage, and a method for manufacturing the same.SOLUTION: A compound semiconductor device includes: a substrate 11; a nitride layer 12 formed on the surface of the substrate 11; an AlN layer 13 which is formed on the nitride layer 12 and has no pit with a diameter of 15 nm or more existing on the surface; and a compound semiconductor layer 14 which is formed above the AlN layer 13 and contains gallium and nitrogen. The compound semiconductor layer 14 includes: a superlattice buffer layer 15 formed above the AlN layer 13; and an active layer 16 formed above the superlattice buffer layer 15. |
申请公布号 |
JP2015002341(A) |
申请公布日期 |
2015.01.05 |
申请号 |
JP20130127905 |
申请日期 |
2013.06.18 |
申请人 |
FUJITSU LTD |
发明人 |
TOMABECHI SHUICHI;KOTANI JUNJI |
分类号 |
H01L21/338;H01L21/205;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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