| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer dividing device capable of properly dividing a wafer by applying an external force to the wafer having a division origin provided therein.SOLUTION: A wafer dividing device includes: frame holding means (50) for holding an annular frame (19) to which a wafer (11) is stuck via a protective tape (21); an air ejection nozzle (20) having a nozzle body (42) and an air ejection groove (46) formed on an upper face (42a) of the nozzle body, the ejection groove being positioned parallel to a division scheduled line (13) and compressed air in a line form being ejected to the protective tape side of the wafer to divide the wafer by a division origin (17) formed along the division scheduled line; and moving means (30) for moving the frame holding means and the air ejection nozzle relatively to each other. |
