发明名称 SOLDER JET DEVICE AND SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To maintain wettability of an outer periphery of a jet nozzle. ! SOLUTION: A solder jet device includes: a solder storage tank for accommodating melted solder; and a jet nozzle 24 extending in a substantially vertical direction and jetting solder fed from the solder storage tank from an upper end part 24a. A plurality of recessed grooves are formed in a substantially horizontal direction in the vicinity of the upper end part in the outer periphery of the jet nozzle 24, and thereby solder flowing out from the upper end part 24a of the jet nozzle 24 can be made residual in the recessed grooves. Accordingly, wettability is maintained in the outer periphery of the jet nozzle 24 even in the state that solder is not jetted from the jet nozzle 24. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015000405(A) 申请公布日期 2015.01.05
申请号 JP20130124552 申请日期 2013.06.13
申请人 FUJITSU TEN LTD 发明人 HAYASHI HISAKI
分类号 B23K1/08;B23K3/00;H05K3/34 主分类号 B23K1/08
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