发明名称 PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a processing device capable of quickly performing laser processing of graphene in an optimum condition, without putting in time and trouble.SOLUTION: A reflectance measurement part 114 measures reflectance, at a processing part, of illumination light radiated from a light source 113 for measuring reflectance. The illumination light radiated from the light source 113 for measuring reflectance is reflected at a semi-reflecting mirror 115, transmitted through a semi-reflecting mirror 106, condensed by a condensing lens 107, and reflected at the processing part. The reflected light reflected at the processing part passes through the condensing lens 107, the semi-reflecting mirror 106, the semi-reflecting mirror 115, a semi-reflecting mirror 111, and a semi-reflecting mirror 112, and light intensity of the reflected light is measured at the reflectance measurement part 114. Since reflected light of a laser for processing is shut out by a cut filter provided on an incident side, the reflectance measurement part 114 can measure reflectance even when the laser for processing is radiated and processing is performed.
申请公布号 JP2015000426(A) 申请公布日期 2015.01.05
申请号 JP20130127341 申请日期 2013.06.18
申请人 NIPPON TELEGR & TELEPH CORP <NTT>;KYUSHU UNIV 发明人 FURUKAWA KAZUAKI;TAKAMURA MAKOTO;HIBINO HIROKI;IKEGAMI HIROSHI
分类号 B23K26/00;B23K26/14;B23K26/18;B23K26/60;B23K26/70;C01B31/02;H01L21/302 主分类号 B23K26/00
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