发明名称 WAFER CHAMFERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer chamfering device which can provide information relating to positional deviation, etc. of a wafer upon chamfering processing of wafer, and information for determination of the necessary time of truing or dressing, and for determination upon ending of truing or dressing operation.SOLUTION: A wafer chamfering device performs chamfering of a wafer by bringing a grindstone of disc shape which is rotated by a spindle into contact with the wafer of disc shape which is rotated. Therein, an AE (Acoustic Emission) sensor is provided, the AE sensor is composed of an AE sensor transmission part and an AE sensor reception part, the AE sensor transmission part is installed at least on any of the grindstone, a base metal of the grindstone and a flange, and the AE sensor reception part is installed on any position in the way of rotation of the AE sensor transmission part which is rotated in accordance with rotation of the spindle and on a place opposite to the AE sensor transmission part.
申请公布号 JP2015000436(A) 申请公布日期 2015.01.05
申请号 JP20130124243 申请日期 2013.06.12
申请人 TOKYO SEIMITSU CO LTD 发明人 NOMURA YOSHIHIRO
分类号 B24B9/00;B24B49/10;H01L21/304 主分类号 B24B9/00
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