| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent erroneous measurement or variation in measurement of an element part due to conduction of the stress of a substrate, connected with a functional element, to the element part.SOLUTION: A sensor 80, as an electronic device, includes a base board 81, a relay board 82 connected onto the base board 81, and a sensor device 1 connected, as a functional element, onto the relay board 82 via a resin adhesive 84 as a bonding material. In the plan view, the outer shape of the relay board 82 is confined to the inside of the outer shape of the sensor device 1.</p> |
