| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component cooling device capable of easily mounting electronic components inside a housing while maintaining sealability of the housing.SOLUTION: In a cooling device of an electronic component 1, one end 7a of a heat pipe 7 for transporting heat as latent heat of working fluid heated, evaporated, heat-radiated and condensed is connected to the electronic component 1 housed inside a predetermined housing 6, so that heat can be transmitted. The other end 7a of the heat pipe 7 is connected to a heat sink 8 provided outside the housing 6, so that heat can be transmitted. The housing 6 comprises: a housing body 4 for housing the electronic component 1; a cover member 5 configured to open/close the housing body 4 and mounted with the heat sink 8; and an insertion hole 5c that is formed on the cover member 5 and in which the heat pipe 7 is inserted. The cover member 5 is constituted by plural split bodies 5a, 5b, and the insertion hole 5c is constituted by the split bodies 5a, 5b arranged adjacently to each other.</p> |
