发明名称 PLASMA PROCESSING METHOD AND VACUUM PROCESSING APPARATUS
摘要 <p>In a plasma processing method of performing a plasma etching process on a metallic material by using halogen gas, and a vacuum processing apparatus, provided is a plasma processing method capable of removing a residual halogen component on a specimen and preventing the surface oxidation of the metallic material and a vacuum processing apparatus. The present invention, in a plasma processing method of performing a plasma etching process on a specimen having a metal-containing layer, includes: performing a plasma process on the specimen by using a mixture gas of halogen gas and nitrogen gas, generating plasma by the mixture gas of oxygen gas and inert gas in a plasma generation chamber and a post process chamber for post-processing the plasma-processed specimen, and transferring the plasma generated through a transfer path arranged between the post process chamber and the plasma generation chamber and performing a post process on the specimen.</p>
申请公布号 KR20150000814(A) 申请公布日期 2015.01.05
申请号 KR20140013251 申请日期 2014.02.05
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 TANAKA KAZUUMI;SUMIYA MASAHIRO
分类号 H01L21/3065 主分类号 H01L21/3065
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