| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of reducing a time required for a recovery operation of a wafer.SOLUTION: A substrate processing apparatus 10 includes a placing base 40 for storing a plurality of wafers W in predetermined receiving positions P-P, respectively, and a wafer transporting arm 31 for receiving the wafer W located in each of the receiving positions P-Pof the placing base 40 and transporting the wafer W to the outside of the placing base 40. The wafer transporting arm 31 is provided with a pressure meter 56 for detecting whether or not the wafer exists on the wafer transporting arm 31. A control unit 80 allows the wafer transporting arm 31 to move to one of the receiving positions P-Pof the placing base 40, determines whether the wafer W exists at one of the receiving positions P-Pon the basis of a detection signal from the pressure meter 56, and when determining that the wafer W does not exist at one of the receiving positions P-P, allows the wafer transporting arm 31 to pass through one of the receiving positions P-Pto move to the next receiving position. |
