EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE OBTAINED BY USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an optical semiconductor device exhibiting an excellent adhesiveness to a metal lead frame.SOLUTION: In an optical semiconductor device possessing: a metal lead frame consisting of first and second plate parts; and a reflector formed so as to surround the periphery of optical semiconductor elements mounted on the metal lead frame, the material for forming the reflector consists of an epoxy resin composition for an optical semiconductor device including not only the following (A) through (D) but also the following (E): (A) an epoxy resin; (B) a curative; (C) a white pigment; (D) an inorganic filler; and (E) at least one adhesiveness imparting agent selected from the group consisting of tris[(3-mercaptopropionyloxy)-ethyl] isocyanurate, trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis(3-mercaptopropionate).