| 摘要 |
PROBLEM TO BE SOLVED: To provide a roughened copper foil excellent in terms not only of fine pattern circuit formability and high-frequency-band transmission characteristics but also of adhesiveness to resin substrates and chemical resistance and to provide a copper-clad laminated sheet obtained by pasting, onto a resin substrate, a copper foil on which a porous copper plating film has been formed and a printed wiring board using the copper-clad laminated sheet.SOLUTION: The provided copper foil is obtained by forming, on at least one surface of a matrix copper foil (untreated copper foil), a porous plating layer at a thickness of 0.1-5.0 μm. Moreover, a plating layer of at least one type selected from among Ni, Ni alloys, Zn, and Zn alloys is configured on the porous plating layer surface. Moreover, a copper-clad laminated sheet obtained by pasting the copper foil onto a resin substrate and a printed wiring board are also provided. |
