ELECTRIC COMPONENT MODULE AND MANUFACTURING METHOD THREROF

摘要

The present invention relates to an electronic component module and a manufacturing method thereof, capable of improving integration by mounting electronic components on both sides of a substrate. For this, the electronic component module according to the embodiment of the present invention includes a first substrate which includes a mounting electrode on both sides thereof and at least one through hole, a plurality of electronic components which are mounted on both sides of the first substrate, a second substrate which includes a through part inside and is bonded to the lower side of the first substrate to receive the electronic components which are mounted on the lower side of the first substrate in the through part; and mold parts which are formed on both sides of the first substrate, seal the electronic components, and are filled in the through hole of the first substrate.