发明名称 |
METAL-RESIN ADHESION STRUCTURE AND METHOD FOR MANUFACTURING THE STRUCTURE, AND CIRCUIT BOARD AND COPPER CLAD LAMINATE WITH THE STRUCTURE |
摘要 |
<p>The present invention discloses a metal-resin adhesion structure, a circuit board and a copper cladding foil layer including metal-resin adhesion structure, and a method for making the same metal-resin adhesion structure. According to the present invention, the meta-resin adhesion structure comprises a resin layer, a metal layer attached to the resin layer, and a modified layer that is disposed on the attaching surface between the resin layer and the metal layer, and comprises a silane coupling agent to provide adhesion between the resin layer and the metal layer.</p> |
申请公布号 |
KR20150000296(A) |
申请公布日期 |
2015.01.02 |
申请号 |
KR20130072568 |
申请日期 |
2013.06.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOON, HYO JIN;JEON, JI EUN;HAM, SUK JIN;CHO, HYE JIN |
分类号 |
B32B15/08;H05K1/09 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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