| 发明名称 |
SEMICONDUCTOR DIE CARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Various embodiments provide a method of manufacturing a semiconductor die carrier structure. The method may include providing a die pad configured to carry a semiconductor die thereon; and bending at least one portion of the die pad, wherein the at least one bent portion extends across the die pad. |
| 申请公布号 |
US2015001696(A1) |
申请公布日期 |
2015.01.01 |
| 申请号 |
US201313929849 |
申请日期 |
2013.06.28 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Chee Meng Chai |
| 分类号 |
H01L23/495;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor die carrier structure, the method comprising:
providing a die pad configured to carry a semiconductor die thereon; bending at least one portion of the die pad, wherein the at least one bent portion extends across the die pad. |
| 地址 |
Neubiberg DE |
