| 发明名称 |
METHOD FOR MANUFACTURING TWO-SIDED PRINTED CIRCUIT BOARD |
| 摘要 |
Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole. |
| 申请公布号 |
US2015000125(A1) |
申请公布日期 |
2015.01.01 |
| 申请号 |
US201314370644 |
申请日期 |
2013.01.04 |
| 申请人 |
INKTEC CO., LTD. |
发明人 |
Chung Kwang-Choon;Han Young-Koo;Yoo Myung-Bong;Yoon Kwang-Baek;Jung Bong-Ki |
| 分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of a double-sided printed circuit board, comprising:
forming a first conductive circuit pattern (20) configuring a circuit on an upper side of an insulation layer (10); forming a second conductive circuit pattern (30) configuring a circuit on a lower side of the insulation layer (10); forming a through hole (40) vertically passing through the insulation layer (10); forming a conductive material (50) on an inner circumferential surface of the through hole (40) such that the first circuit pattern (20) and the second circuit pattern (30) are electrically connected by the through hole (40). |
| 地址 |
Gyeonggi-do KR |
