PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM

摘要

A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.

主权项

1. A process condition sensing wafer and data analysis system, comprising:
an instrumented substrate having sensors that output sensor signal data; a data processing system that processes the sensor signal data that is output by the sensor; an electronics module that moves independently of the data processing system, the electronics module receiving the sensor signal data from the instrumented substrate, the electronics module subsequently passing the sensor signal data to the data processing system; and a physically continuous flexible connection between the electronics module and the instrumented substrate, the connection allowing relative movement of the electronics module with respect to the instrumented substrate.