环氧化合物、环氧树脂及其制造方法、硬化性组成物、其硬化物、半导体密封材料、及印刷配线基板;EPOXY COMPOUND, EPOXY RESIN AND MANUFACTURING METHOD THEREOF, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED WIRING BOARD

摘要

本发明提供一种硬化物的耐热性及阻燃性优异的环氧化合物、含有其的环氧树脂、硬化性组成物与其硬化物、及半导体密封材料。一种环氧化合物，其特征在于：具有二伸芳基[b,d]呋喃结构，2个伸芳基中的至少一个具有伸萘基骨架，且2个伸芳基均于其芳香核上具有缩水甘油氧基。; an epoxy resin containing the same; a curable composition and the cured product thereof; and a semiconductor sealing material. The epoxy compound is characterized by having a diarylene [b,d] furan structure; at least one of the two arylene groups has a naphthylene skeleton, and both arylene groups have a glycidyloxy group on its aromatic nucleus.