发明名称 |
ELECTRIC FIELD GAP DEVICE AND MANUFACTURING METHOD |
摘要 |
Substrate material is oxidised around side walls of a set of channels. A shielding structure means there is more oxide growth at the top than the bottom with the result that the non-oxidised substrate material area between the channels forms a tapered shape with a pointed tip at the top. These pointed substrate areas are then used to form cathodes. |
申请公布号 |
US2015001671(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201414293146 |
申请日期 |
2014.06.02 |
申请人 |
NXP B.V. |
发明人 |
IN 'T ZANDT Michael;WUNNICKE Olaf;REIMANN Klaus |
分类号 |
H01L23/60;H01L29/06;H01L21/74;H01L21/762 |
主分类号 |
H01L23/60 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of forming an electric field gap structure, comprising:
providing a silicon substrate; etching cathode channels into the substrate; lining the resulting surface with a lining dielectric layer; forming shielding regions on the cathode channel side walls but leaving an unshielded portion at the top of the cathode channels; oxidising the substrate at the unshielded portion of the cathode channels, thereby to leave pointed non-oxidised substrate regions between the cathode channels; etching away the layers at and above the pointed substrate regions providing a cathode contact over each pointed substrate region; forming a sacrificial layer over the cathode contacts; providing an anode metal layer over the sacrificial layer; etching the sacrificial layer to form a cavity between the cathode contacts and the anode metal layer. |
地址 |
Eindhoven NL |