发明名称 ELECTRIC FIELD GAP DEVICE AND MANUFACTURING METHOD
摘要 Substrate material is oxidised around side walls of a set of channels. A shielding structure means there is more oxide growth at the top than the bottom with the result that the non-oxidised substrate material area between the channels forms a tapered shape with a pointed tip at the top. These pointed substrate areas are then used to form cathodes.
申请公布号 US2015001671(A1) 申请公布日期 2015.01.01
申请号 US201414293146 申请日期 2014.06.02
申请人 NXP B.V. 发明人 IN 'T ZANDT Michael;WUNNICKE Olaf;REIMANN Klaus
分类号 H01L23/60;H01L29/06;H01L21/74;H01L21/762 主分类号 H01L23/60
代理机构 代理人
主权项 1. A method of forming an electric field gap structure, comprising: providing a silicon substrate; etching cathode channels into the substrate; lining the resulting surface with a lining dielectric layer; forming shielding regions on the cathode channel side walls but leaving an unshielded portion at the top of the cathode channels; oxidising the substrate at the unshielded portion of the cathode channels, thereby to leave pointed non-oxidised substrate regions between the cathode channels; etching away the layers at and above the pointed substrate regions providing a cathode contact over each pointed substrate region; forming a sacrificial layer over the cathode contacts; providing an anode metal layer over the sacrificial layer; etching the sacrificial layer to form a cavity between the cathode contacts and the anode metal layer.
地址 Eindhoven NL