MULTI-SPOT SOLDERING APPARATUS

摘要

A multi-spot soldering apparatus which applies temperature protection to molten solder to be applied to the contacts of electronic components on printed circuit boards is provided. The multi-spot soldering apparatus includes a bottom plate, a number of containers mounted on the bottom plate and communicating with the multiple solder pot, and a number of protrusions mounted on the containers. Each of the protrusions defines an opening communicating with a container and the size and shape of each protrusion reduces the exposure of molten solder to ambient temperatures and reduces the distance that the molten solder must travel before application to a contact of an electronic component.

主权项

1. A multi-spot soldering apparatus for being placed on a solder pot, and configured to weld a plurality of elements mounted on a printed circuit board (PCB), the multi-spot soldering apparatus comprising:
a bottom plate to be placed on the solder pot; a plurality of containers mounted on the bottom plate and to communicate with the solder pot; and a plurality of protrusions mounted on the containers, and each of the protrusions defining an opening communicating with a corresponding container; wherein the size of each of the plurality of containers is greater than the size of each of the plurality of protrusions.