| 摘要 |
Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack. Moreover, an example system for cooling electronic components housed in a rack may further include a number of electronics sections (104, 106, 204, 206, 304, 306, 404-1, 404-2, 406-1, 406-2, 412-2) including at least a first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414), and a number of cooling sections (112, 212, 312, 412-1) including at least a first cooling system (102, 202, 402) that cools at least the first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414) via heat transfer through the number of dividers(108-1, 208-1, 308-1, 408-1). |
