发明名称 |
IMAGING ELEMENT, IMAGING APPARATUS, ITS CONTROL METHOD, AND CONTROL PROGRAM |
摘要 |
An imaging element having a layered structure including a first chip having a pixel portion in which pixels for photoelectrically converting an optical image of an object and generating a pixel signal are arranged two-dimensionally and a second chip in which a drive means of the pixel portion is arranged, and having a first output path to output the pixel signals of at least a first pixel group in the pixel portion and a second output path to output the pixel signals of a second pixel group, comprises the a conversion means for converting the pixel signals of the first and second output paths into digital signals and a control information generation means for generating control information of a photographing operation of the object by using the digital signal converted by the conversion means, wherein at least a part of the conversion means is arranged in the first chip. |
申请公布号 |
US2015002715(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201414312862 |
申请日期 |
2014.06.24 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Ise Makoto |
分类号 |
H04N5/232;H04N5/378;H04N9/73;H04N5/374;H04N5/235 |
主分类号 |
H04N5/232 |
代理机构 |
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代理人 |
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主权项 |
1. An imaging element having a layered structure which includes a first chip having a pixel portion in which pixels each for photoelectrically converting an optical image of an object and generating a pixel signal are arranged in a matrix form and a second chip in which a drive unit of the pixel portion is arranged and having a first output path for outputting the pixel signals of at least a first pixel group in the pixel portion and a second output path for outputting the pixel signals of a second pixel group, comprising:
a conversion unit configured to convert the pixel signals of the first output path and the second output path into digital signals; and a control information generation unit configured to generate control information of a photographing operation of the object by using the digital signal converted by the conversion unit, wherein at least a part of the conversion unit is arranged in the first chip. |
地址 |
Tokyo JP |