发明名称 SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
摘要 Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.
申请公布号 US2015002360(A1) 申请公布日期 2015.01.01
申请号 US201414487711 申请日期 2014.09.16
申请人 Sony Corporation 发明人 Kawamura Hirofumi
分类号 H01Q21/00 主分类号 H01Q21/00
代理机构 代理人
主权项 1. A transmission system comprising: a first semiconductor device configured to include a first semiconductor circuit element that processes an electrical signal having a predetermined frequency, a first transmission line that is connected to the first semiconductor circuit element via a wire and transmits the electrical signal, and a first antenna part that converts the electrical signal transmitted from the first transmission line to an electromagnetic wave signal and sends the electromagnetic wave signal; a second semiconductor device configured to include a second antenna part that receives the electromagnetic wave signal sent from the first antenna part and converts the electromagnetic wave signal to an electrical signal having the predetermined frequency, a second transmission line that transmits the electrical signal arising from conversion by the second antenna part, and a second semiconductor circuit element that is connected to the second transmission line via a wire and processes the electrical signal transmitted by the second transmission line; and a dielectric transmission path configured to be provided between the first semiconductor device and the second semiconductor device and have a predetermined dielectric constant, the dielectric transmission path transmitting the electrical signal from the first semiconductor device to the second semiconductor device, wherein impedance matching patterns having symmetric shapes with respect to directions of the first and second transmission lines are provided in the first and second transmission lines.
地址 Tokyo JP