| 摘要 |
本发明公开了硬罩幕组成物、使用其形成图案的方法以及包括此图案的半导体积体电路装置，其中硬罩幕组成物包括由以下化学式1表示的单体；包含由以下化学式2表示的部分的聚合物、包含由以下化学式3表示的部分的聚合物或者它们的组合；以及溶剂。在以下化学式1至化学式3中，A、A'、A"、L、L'、X、X'、m、n、Ar、B、X a 以及X b 与具体实施方式中限定的相同。;[化学式2] Disclosed are hardmask composition, method of forming patterns using the hardmask composition and semiconductor integrated circuit device including the patterns including the patterns, wherein the hardmask composition including a monomer represented by the following Chemical Formula 1, a polymer including a moiety represented by the following Chemical Formula 2, a polymer including a moiety represented by the following Chemical Formula 3, or a combination thereof, and a solvent. ;[Chemical Formula 3] ;In the above Chemical Formulae 1 to 3, A, A', A", L, L', X, X', m, n, Ar, B, X a and X b are the same as defined in the detailed description. |
