发明名称 |
SUBSTRATE WITH HIGH FRACTURE STRENGTH |
摘要 |
The invention discloses a substrate with high fracture strength. The substrate according to the present invention includes a plurality of nanostructures. The substrate has a first surface, where the nanostructures protrude from the first surface. Through the formation of the nanostructures, the fracture strength of the substrate is enhanced. |
申请公布号 |
US2015004366(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201414489975 |
申请日期 |
2014.09.18 |
申请人 |
National Tsing Hua University |
发明人 |
Yeh Jer-Liang |
分类号 |
H01L31/028;H01L29/04;H01L29/06 |
主分类号 |
H01L31/028 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate with high fracture strength, comprising:
a substrate having a first surface, the first surface having a dislocation density in a range of 10 ea/cm2 to 2,000 ea/cm2; and a plurality of first nanostructures formed on the first surface of the substrate, each of the heights of the plurality of first nanostructures being in a range of 2 μm to 20 μm, each aspect ratio of the plurality of first nanostructures being in a range of 20 to 200, the first aspect ratio R1 is defined by a formula of R1=B1/D1, wherein D1 is an average width of each of the first nanostructures, and B1 is a height of each first nanostructure. |
地址 |
Hsinchu TW |