发明名称 SUBSTRATE WITH HIGH FRACTURE STRENGTH
摘要 The invention discloses a substrate with high fracture strength. The substrate according to the present invention includes a plurality of nanostructures. The substrate has a first surface, where the nanostructures protrude from the first surface. Through the formation of the nanostructures, the fracture strength of the substrate is enhanced.
申请公布号 US2015004366(A1) 申请公布日期 2015.01.01
申请号 US201414489975 申请日期 2014.09.18
申请人 National Tsing Hua University 发明人 Yeh Jer-Liang
分类号 H01L31/028;H01L29/04;H01L29/06 主分类号 H01L31/028
代理机构 代理人
主权项 1. A substrate with high fracture strength, comprising: a substrate having a first surface, the first surface having a dislocation density in a range of 10 ea/cm2 to 2,000 ea/cm2; and a plurality of first nanostructures formed on the first surface of the substrate, each of the heights of the plurality of first nanostructures being in a range of 2 μm to 20 μm, each aspect ratio of the plurality of first nanostructures being in a range of 20 to 200, the first aspect ratio R1 is defined by a formula of R1=B1/D1, wherein D1 is an average width of each of the first nanostructures, and B1 is a height of each first nanostructure.
地址 Hsinchu TW