WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING BOARD

摘要

A wiring board includes a first via hole in a first insulating layer to expose a first wiring layer. A first via in the first via hole includes an end surface. A second wiring layer is arranged on the first insulating layer and the end surface of the first via. A second insulating layer covers the second wiring layer. A second via hole in the second insulating layer exposes the second wiring layer. A second via in the second via hole is arranged above the first via through the second wiring layer. The outer surface of the first insulating layer is lower in surface roughness than an inner surface of the first via hole.

主权项

1. A wiring board comprising:
a first wiring layer; a first insulating layer covering the first wiring layer; a first via hole having an opening in an outer surface of the first insulating layer, an outer surface of the first wiring layer being exposed through the first via hole; a first via filling in the first via hole, the first via including an end surface exposed at the outer surface of the first insulating layer; a second wiring layer arranged on the outer surface of the first insulating layer and the end surface of the first via; a second insulating layer covering the second wiring layer; a second via hole having an opening in an outer surface of the second insulating layer, the outer surface of the second wiring layer being exposed through the second via hole; and a second via filling in the second via hole, the second via being smaller in diameter than the first via, the second via being arranged above the first via through the second wiring layer, wherein the outer surface of the first insulating layer is lower in surface roughness than an inner surface of the first via hole.