| 发明名称 |
PACKAGED SEMICONDUCTOR DEVICE |
| 摘要 |
A packaged semiconductor device includes a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; and an encapsulant surrounding the semiconductor die. At least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead includes a thin portion external to the encapsulant and a thick portion that is surrounded by the encapsulant, wherein the thin portion is thinner than the thick portion. |
| 申请公布号 |
US2015001691(A1) |
申请公布日期 |
2015.01.01 |
| 申请号 |
US201313928876 |
申请日期 |
2013.06.27 |
| 申请人 |
HIGGINS, III LEO M. |
发明人 |
HIGGINS, III LEO M. |
| 分类号 |
H01L23/495;H01L23/28;H01L21/56;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged semiconductor device, comprising:
a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; and an encapsulant surrounding the semiconductor die, wherein at least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead comprises a thin portion external to the encapsulant and a thick portion that is surrounded by the encapsulant, wherein the thin portion is thinner than the thick portion. |
| 地址 |
Austin TX US |
