| 主权项 |
1. A semiconductor device for use in a package comprising an output pin and a reference pin, the semiconductor device comprising a plurality of output pads bondable to the output pin, a plurality of reference pads bondable to the reference pin, and an output driver circuitry having a control terminal for receiving a control signal and arranged to drive the plurality of output pads relative to the plurality of reference pads in dependence on the control signal,
the output driver circuitry comprising a plurality of driver sections and a selection circuitry, each driver section having a driver control terminal for receiving a section control signal, a section reference terminal and a section output terminal, the section reference terminal connected to a single reference pad from the plurality of reference pads, the section output terminal connected to a single output pad from the plurality of output pads, the driver section being arranged to drive the single output pad relative to the single reference pad in dependence on the section control signal, the plurality of reference pads being connected in a one-to-one relationship to the plurality of driver sections, the plurality of output pads being connected in a one-to-one relationship to the plurality of driver sections, the selection circuitry having at least one selection input terminal for receiving at least one selection signal, a selection control terminal connected to the control terminal for receiving the control signal, a plurality of selection output terminals, each selection output terminal of the plurality of selection output terminals being connected to a respective section control terminal of a respective driver section of the plurality of driver sections and arranged to provide respective section control signals to each of the section control terminals of the plurality of driver sections in dependence on the at least one selection signal and the control signal. |
