发明名称 INTEGRATED CIRCUIT FABRICATION
摘要 A method for defining patterns in an integrated circuit comprises defining a plurality of features in a first photoresist layer using photolithography over a first region of a substrate. The method further comprises using pitch multiplication to produce at least two features in a lower masking layer for each feature in the photoresist layer. The features in the lower masking layer include looped ends. The method further comprises covering with a second photoresist layer a second region of the substrate including the looped ends in the lower masking layer. The method further comprises etching a pattern of trenches in the substrate through the features in the lower masking layer without etching in the second region. The trenches have a trench width.
申请公布号 US2015004786(A1) 申请公布日期 2015.01.01
申请号 US201414486890 申请日期 2014.09.15
申请人 MICRON TECHNOLOGY, INC. 发明人 Tran Luan C.;Lee John;Liu Zengtao;Freeman Eric;Nielsen Russell
分类号 H01L21/768;H01L21/306;H01L21/308;H01L21/033 主分类号 H01L21/768
代理机构 代理人
主权项 1. (canceled)
地址 Boise ID US