| 发明名称 |
WAFER CHARGING ELECTROMAGNETIC INSPECTION TOOL AND METHOD OF USING |
| 摘要 |
An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface. |
| 申请公布号 |
US2015002835(A1) |
申请公布日期 |
2015.01.01 |
| 申请号 |
US201313927693 |
申请日期 |
2013.06.26 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY., LTD. |
发明人 |
KUO Ming-Sung;SU Chiun-Chieh;CHU Chih-Shun;CHEN To-Yu |
| 分类号 |
G01N21/95 |
主分类号 |
G01N21/95 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electromagnetic inspection tool comprising:
a stage configured to support a wafer having a first surface; an emitter configured to emit electromagnetic waves to be incident on the first surface; a detector configured to detect electromagnetic waves returned from the first surface; and a charging mechanism configured to charge the first surface. |
| 地址 |
Hsinchu TW |
