SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE

摘要

The present invention relates to a socket device for testing a semiconductor device and, particularly, to a socket device which is capable of testing ball grid array (BGA) and land grid array (LGA) type semiconductor devices or a BGA/LGA hybrid semiconductor device according to the shapes of the leads of the semiconductor devices. A latch structure for pressing and fixing the semiconductor device is improved such that a roller is provided at the front end of a latch so as to minimize wear caused by sliding friction with a sandpaper-like surface on the upper surface of the semiconductor device, even in the case of approximately one hundred thousand or more rounds of testing, thereby remarkably extending the life of the socket device, increasing testing efficiency, and reducing costs.