OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

An optoelectronic component (10, 20, 30, 40) comprises an optoelectronic semiconductor chip (200) which is embedded in a moulding (100) so that at least part of an upper face (201) of the optoelectronic semiconductor chip (200) is not covered by the moulding (100). A first metallic coating (510) is disposed on an upper face (101) of the moulding (100). The first metallic coating (510) is electrically insulated with respect to the optoelectronic semiconductor chip (200). A first material (610, 615) is disposed on the first metallic coating (510).