发明名称 A CIRCUIT BOARD COMPRISING AN INSULATING DIAMOND MATERIAL
摘要 A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
申请公布号 WO2014205489(A1) 申请公布日期 2014.12.31
申请号 WO2014AU00660 申请日期 2014.06.25
申请人 THE UNIVERSITY OF MELBOURNE;NATIONAL ICT AUSTRALIA LIMITED 发明人 LICHTER, SAMANTHA;APOLLO, NICHOLAS;GARRETT, DAVID;GANESAN, KUMARAVELU;MEFFIN, HAMISH;PRAWER, STEVEN
分类号 H05K1/00;A61N1/00;H01L23/00 主分类号 H05K1/00
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