发明名称 |
FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM |
摘要 |
Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed. The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13. |
申请公布号 |
EP2818585(A1) |
申请公布日期 |
2014.12.31 |
申请号 |
EP20130751478 |
申请日期 |
2013.02.21 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
HIRAOKA, MOTOKI;YANAGIMOTO, HIROSHI;SATO, YUKI;YOSHIOKA, TAKAYASU |
分类号 |
C25D17/12;C25D3/00;C25D3/38;C25D5/02;C25D5/08;C25D5/34;C25D17/00 |
主分类号 |
C25D17/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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