NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING HARDENING RELIEF PATTERN, AND SEMICONDUCTOR DEVICE

摘要

Provided is a negative photosensitive resin composition containing (A) 100 mass parts of a polyimide precursor having a structure expressed by the general formula (1) shown below (R1, R2, X1, and Y1 are as defined in the specification), and (B) 0.1-20 parts by mass of a photopolymerization initiator.