METHOD FOR PROCESSING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ARRANGEMENT

摘要

A method (200) for processing an electronic component (130) is disclosed in various embodiments. Said method comprises the following steps: applying (204) a flat structure (128) that is provided with predetermined separation points (304) onto the electronic component (130); and removing (208) a part (306, 404) of the flat structure (128) applied to the component, the step of removing (208) including separating the flat structure (128) in the predetermined separation points (304).