| 摘要 |
<p>This semiconductor package mounting structure is provided with: a semiconductor package having a semiconductor device housed therein; a wiring board, which is connected to the semiconductor package, and which has at least one through hole penetrating the wiring board in the thickness direction; and a side fill material, which is applied to the whole circumference of the semiconductor package, and which reinforces the connection between the semiconductor package and the wiring board by being adhered to the side surfaces of the semiconductor package and a surface of the wiring board.</p> |
