INTEGRATED CIRCUIT PACKAGE HAVING A SPLIT LEAD FRAME
摘要
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. The sensor further includes at least one wire bond coupled between the die and a first surface of the lead frame. The die is attached to a second, opposing surface of the lead frame in a lead on chip configuration. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
申请公布号
EP2817647(A1)
申请公布日期
2014.12.31
申请号
EP20130712040
申请日期
2013.03.11
申请人
ALLEGRO MICROSYSTEMS, LLC
发明人
TAYLOR, WILLIAM P.;DAVID, PAUL;VIG, RAVI;SCHELLER, P. KARL;FRIEDRICH, ANDREAS P.