| 摘要 |
The present invention is a component mounting machine which is provided with a substrate transport device, a component supply device, a component transfer device having a mounting head and a head drive mechanism, and a mounting order control device, and which partitions an elongated substrate of a length exceeding a mounting station into a plurality of mounting areas, and sequentially positions each of the mounting areas into the mounting station in order to mount electronic components thereupon. The component transfer device uses, in combination, a general-purpose mounting head for which many types of components can be mounted, and a high-speed mounting head for which fewer types of components can be mounted relative to the general-purpose mounting head and which gathers multiple electronic components at one time so as to perform transport at a low transport height, and the mounting order control device modifies mounting order for the electronic components so as to reduce the number of times of switching of the mounting head which operates and/or the number of times of positioning of the elongated substrate. As a result, it is possible to provide a multiple head combination-type component mounting machine which is capable of shortening the total mounting time for mounting all predetermined electronic components on one elongated substrate. |
