ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAID ELECTRONIC DEVICE

摘要

An air vent (16) is formed in a substrate (10) for this electronic device and made such that air from inside the cavity of a mold (90) escapes through said air vent (16) when a resin is being molded. A solder resist (17) is laid out on a second surface (12) of the aforementioned substrate (10), and an opening (17a) is formed in the part of said solder resist (17) that corresponds to the aforementioned air vent (16). This makes it possible to make it such that air also escapes from between a lower mold (91) and the solder resist (17) due to asperities on the surface of the solder resist (17) and the abovementioned resin remains in a space (18) formed between the second surface (12) of the substrate (10) and the lower mold (91). This inhibits spillage of resin passing by the air vent (16) and prevents the substrate (10) and the mold (90) from sticking together and making the air vent (16) stop functioning as an air vent.