发明名称 |
HEAT SINK FOR LED MODULE |
摘要 |
The present invention relates to a heat radiation apparatus of an LED module for increasing the radiation efficiency of the LED module by manufacturing the heat radiation apparatus so that the thermal transfer rates of upper and lower parts which radiate the heat of the LED module are different from each other. |
申请公布号 |
KR101477688(B1) |
申请公布日期 |
2014.12.31 |
申请号 |
KR20140122827 |
申请日期 |
2014.09.16 |
申请人 |
PARU CO., LTD. |
发明人 |
KANG, MOON SIG;RYU, CHANG WAN;RYU, YOUNG JO |
分类号 |
F21V29/00;F21S2/00;F21W101/02 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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