PATTERNED THIN FOIL

摘要

An adhesive may be applied to a surface of a reusable carrier (102). Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier (104). The metal foil may be patterned without damaging the reusable carrier (106). A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil (108). The reusable carrier may then be removed (110). In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant (112).