发明名称 MOLDING RESIN COMPOSITION
摘要 The present invention addresses the problem of providing a molding resin composition which includes an inorganic reinforcing material, wherein a molded body of the resin composition has excellent shock resistance, high surface gloss and good mold releasability. To solve the above problem, a molding resin composition is provided which comprises: 94 to 49 parts by weight of at least one type of resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin; 5 to 50 parts by weight of an inorganic reinforcing material (B); 1 to 46 parts by weight of a functional group-containing olefin polymer (C) which includes a component having Tg of -140°C to 0°C (provided that a total of the component (A), component (B) and component (C) is 100 parts by weight), and 0.01 to 10 parts by weight of an olefin wax (D) which includes a group having an element selected from oxygen and nitrogen, the weight ratio C/D of the component (C) and component (D) being 0.3 to 30.
申请公布号 WO2014208071(A1) 申请公布日期 2014.12.31
申请号 WO2014JP03349 申请日期 2014.06.23
申请人 MITSUI CHEMICALS, INC. 发明人 KANAYA, HIROTAKA;KAWABE, KUNIAKI;TANAKA, MASAKAZU
分类号 C08L101/00;C08J3/22;C08K7/04;C08L9/00;C08L91/06 主分类号 C08L101/00
代理机构 代理人
主权项
地址