| 摘要 |
<p>A semiconductor package is provided. The semiconductor package includes: a substrate which includes a ground pattern and a pad which are separated and are electrically insulated; a semiconductor chip which includes an active surface and an inactive surface which is opposite to the active surface, and is mounted on the substrate; a bump which is interposed between the active surface and the pad and electrically connects the active surface to the pad; and a conductive member which is arranged on the inactive surface and includes at least a part which is electrically connected to the ground pattern.</p> |
