| 摘要 |
A metal contact of a solar cell is formed by electroplating copper using an electroplating seed that is formed on a dielectric layer (211). The electroplating seed includes an aluminum layer that connects to a diffusion region of the solar cell through a contact hole in the dielectric layer. A nickel layer is formed on the aluminum layer, with the nickel layer-aluminum layer stack forming the electroplating seed (212). The copper is electroplated in a copper plating bath that has methanesulfonic acid instead of sulfuric acid as the supporting electrolyte (213). |
