发明名称 APPLICATION APPARATUS AND APPLICATION METHOD
摘要 The purpose of the present invention is to provide an application apparatus that can protect a peripheral part including the section of a substrate, can protect the generation of dust at the end part of the substrate and can apply membrane forming liquid to the peripheral part including the section of the substrate thinly and uniformly. The application apparatus (1) for applying liquid to a peripheral part including the section of a substrate comprises: a supporting table (10) for supporting a substrate (2); a pair of application rollers (22a) arranged to face each other to grab the end part of the substrate (2); an application unit (20) including an application roller (22b); a moving unit (40) for moving the application unit (20); a liquid supply unit (50) for supplying membrane forming liquid (56) to each of the pair of the application rollers (22a) and the application roller (22b); and a control part (70) for controlling the moving unit (40) so as to move the pair of the application rollers (22a) and the application roller (22b) along the peripheral part of the substrate (2) as the end part of the substrate (2) supported by the supporting table (10) is grabbed by the pair of the application rollers (22a) and the application roller (22b).
申请公布号 KR20140148271(A) 申请公布日期 2014.12.31
申请号 KR20130128406 申请日期 2013.10.28
申请人 ENATECH CORPORATION 发明人 MATSUYAMA TAKAO
分类号 B05C1/08;B05C1/12;B05C9/12;B05C11/00 主分类号 B05C1/08
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