发明名称 METHODS OF DEPOSITING A METAL ALLOY FILM
摘要 Provided are methods of depositing films comprising exposing at least a portion of a substrate to a metal precursor to provide a first metal on the substrate and an organometallic reducing agent to deposit a second metal on the substrate to form a mixture or alloy of the first metal and the second metal. Exposure to the metal precursor and organometallic reducing agent can be in either order or simultaneously.
申请公布号 WO2014210328(A1) 申请公布日期 2014.12.31
申请号 WO2014US44369 申请日期 2014.06.26
申请人 APPLIED MATERIALS, INC.;THOMPSON, DAVID;ANTHIS, JEFFREY W. 发明人 THOMPSON, DAVID;ANTHIS, JEFFREY W.
分类号 H01L21/205;H01L21/283 主分类号 H01L21/205
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