| 摘要 |
A method of fabrication of a microfluidic chip comprises providing a substrate (10, figure 1), a face of which is covered by an electrically insulating layer 30, obtaining a resist layer (40, figure 9) covering one or more selected portions of the electrically insulating layer, at least a remaining portion of said electrically insulating layer not being covered by the resist layer, partially etching with a wet etchant a surface of the remaining portion of the electrically insulating layer to create a recess (40r) and/or an undercut (40u) under the resist layer, depositing an electrically conductive layer 50 on the etched surface (35) such that the electrically conductive layer reaches the created recess and/or undercut and removing the resist layer to expose a portion of the electrically insulating layer adjoining a contiguous portion of the electrically conductive layer. Also disclosed is a microfluidic chip obtainable by the method of the invention comprising an electrically conductive layer covering at least partly an electrically insulating layer, wherein an exposed surface of the electrically conductive layer adjoins an exposed surface of a contiguous portion of the electrically insulating layer. |
