| 摘要 |
Methods of forming semiconductor structures comprising one or more cavities (106), which may be used in the formation of microelectromechanical system (MEMS) transducers, involve forming one or more cavities in a first substrate (100), providing a sacrificial material (110) within the one or more cavities, bonding a second substrate (120) over the a surface of the first substrate, forming one or more apertures (140) through a portion of the first substrate to the sacrificial material, and removing the sacrificial material from within the one or more cavities. Structures and devices are fabricated using such methods. |
