发明名称 |
SOLDER MATERIAL AND SOLDER JOINT |
摘要 |
<p> The purpose of the present invention is to provide a solder material in which the amount of radiatedα-rays can be reduced. A solder ball (1A), which is a solder material, is provided with a nuclei layer (2A) having sufficient diameter to maintain distance between a bonding object and a bonded object, and a solder layer (3A) coating the nuclei layer (2A). The solder layer (3A) is configured from a metal material that: has a melting point at a temperature at which the nuclei layer (2A) does not melt, the metal material solidifying and thereby bonding the bonding object and the bonded object to each other; and has sufficient thickness to blockα-rays radiated from the nuclei layer (2A).</p> |
申请公布号 |
WO2014207897(A1) |
申请公布日期 |
2014.12.31 |
申请号 |
WO2013JP67829 |
申请日期 |
2013.06.28 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
KAWASAKI HIROYOSHI;HASHIMOTO TOMOHIKO;IKEDA ATSUSHI;ROPPONGI TAKAHIRO;SOMA DAISUKE;SATO ISAMU;KAWAMATA YUJI |
分类号 |
B23K35/14;B22F1/02;B23K35/26;C22C5/06;C22C13/00 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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