发明名称 |
Method of manufacturing an array of optical devices |
摘要 |
<p>An array of optical devices includes singlets diced or separated from a first diced surface and a second diced surface of a semiconductor wafer. Each singlet includes a single optical emitter or a single photosensitive semiconductor device. The singlets are identified as operationally fit before being arranged in corresponding features in a receiving region of a submount. The corresponding features of the submount are arranged to align and precisely control the pitch or separation distance between optical portions of a desired number of singlets. The use of operationally fit singlets dramatically increases production efficiency as it is no longer necessary to identify N contiguous operational optical devices in a semiconductor wafer to produce a precisely aligned array of N operational optical devices.</p> |
申请公布号 |
GB2511234(B) |
申请公布日期 |
2014.12.31 |
申请号 |
GB20140008937 |
申请日期 |
2011.07.20 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD |
发明人 |
SENG-KUM CHAN |
分类号 |
H01L25/075;H01S5/022;H01S5/40 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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